![]() ![]() Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc. ? Compatible with all commonly used lead free surface finishes (ENTEK HT Alpha Star ? Potential elimination of bar solder, wave soldering flux and energy costs associated with ? Reduces energy consumption in reflow ovens versus standard lead free alloys ? Enables elimination of a second or third reflow cycle when temperature sensitive Tags: lead free solder paste, Paste, Rework Paste, Solder, Solder Paste, solder paste tubs, solder syringe, Soldering Tin/lead/bismuth phase which has a melting point under 100 ?C. The alloys yield very low voiding BGA solder joints, even when a traditionalĪll components used with ALPHA OM-525 must be lead-free to eliminate the formation of These eliminations can significantly lower the cost of producing anĮlectronic assembly. In addition, it allows the desired obsolescence of anĮxtra SMT process. Supplies and eliminate the need for pallets. Tools needed to setup a solder paste reflow profile: Calibrated profiler with at least four thermal couple ports and thermal couple wires. Misprints and stencil cleaning may be done with ALPHA SM-110E, ALPHA SM-440, ALPHA. ALPHA OM-550 residue is designed to remain on the board after reflow. Increased daily throughput, eliminate the need for managing bar solder and wave soldering flux ALPHA OM-5100 ’s wide reflow profile window enables soldering of lead free components with this tin lead paste. A 0.4 to 0.6 paste volume to sphere volume ratio is recommended. Temperature sensitive through-hole components are used in an assembly. This product enables the elimination of an extra wave or selective wave soldering process when Provides excellent electrical resistivity, exceeding industry standards. ALPHA SBX02 alloy has improved Mechanical Strength andĭrop Shock Resistance than the SnBi0.4Ag alloy. SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profilesīetween 155 ?C and 190 ?C. Excellent solder and flux cosmetics after reflow soldering Reduction in. ALPHA OM-525 solder paste version with ALPHA solder paste designed for a broad range of. Its key attribute is excellent no-solderĭrip phenomena during the reflow process. Reflow application for assembly of double sided board. All rights reserved.ALPHA OM-525 is a low temperature solder paste technology designed to enable a single Digi strongly recommends to solder the ConnectCore i.MX6 module during the last reflow cycles of the carrier board manufacturing process. Two (2) reflow cycles are remaining for mounting the module on the carrier board. Ultra-Low Voiding, High-Reliability, Rohs Compliant, Zero-Halogen, Solder Paste. Two reflow cycles are required for manufacturing the ConnectCore i.MX6 SOM. ALPHA OM-358 SOLDER PASTE Technical Bulletin Issue: 08 January 2020 of 6. ALPHA OM-325 yields excellent print capability performance across various board designs and. ALPHA OM-325’s has a wide processing window that provides a surface mount process solution for component metrics down to 0402mm (01005inch). The ConnectCore i.MX6 is approved to withstand a total of four reflow cycles. ALPHA OM-325 is a Lead-Free, no-clean solder paste designed for -Fine feature printing and reflow. Optimization of a reflow profile will depend on the selected solder paste/reflow machine (reflow or vapor phase) and carrier board design. Figure 1 CVP-520 Reflow Profile Envelope. The use of ALPHA Exactalloy performs may. The reflow profile shown above is valid for the combination solder paste/reflow machine and Digi reference carrier board. LOW MELTING POINT NO-CLEAN LEAD-FREE HALOGEN FREE SOLDER PASTE. The following image shows the reflow profile based on a ten-zone oven, with SAC 305 Lead-Free Solder Paste (Alpha OM-340). The second thermal probe location is on the inner row of pads preferably a signal pad. The first recommended thermal probe location is on the outer row of pads, to be on the out most row of pins preferably a ground pad. Use of 40AWG K-type thermal couple and M.O.L.E or equivalent thermal profiler is recommended. Time Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. ![]()
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